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Your cart is empty.Description: Black ESD Foam, Lead Insertion Grade, 12" x 9" x 1/4". Designed for IC leg and pin insertion. Can also be used for blocking, bracing, cushioning and wrapping sensitive electronic devices. Crosslinked high-density polyethylene, rigid, closed-cell, carbon loaded, conductive, surface resistance 1x10^3 to 1x10^5 ohms/square. Specifications: Foam Type: Crosslinked high-density polyethylene, rigid, closed-cell, carbon loaded, conductive Surface Resistance: 10^3 to 10^5 ohms/square Dimension: 12" x 9" (304.8 x 228.6 mm) Thickness: 0.25" (6.35 mm) Dimensional Tolerances: +/- 2%
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