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Your cart is empty.Description: Black ESD Foam, Lead Insertion Grade, 18" x 12" x 1/4". Designed for IC leg and pin insertion. Can also be used for blocking, bracing, cushioning and wrapping sensitive electronic devices. Crosslinked high-density polyethylene, rigid, closed-cell, carbon loaded, conductive, surface resistance 1x10^3 to 1x10^5 ohms/square. Specifications: Foam Type: Crosslinked high-density polyethylene, rigid, closed-cell, carbon loaded, conductive Surface Resistance: 10^3 to 10^5 ohms/square Dimension: 18" x 12" (457.2 x 304.8 mm) Thickness: 0.25" (6.35 mm) Dimensional Tolerances: +/- 2%
Jeremy
Reviewed in the United States on January 5, 2025
If you work with electronics, you probably have hundreds of ICs stored somewhat haphazardly in tubes, anti-static bags, in little sample boxes, and in small pieces of foam just like this.I got this large piece of foam so I could organize my ICs. I just cut pieces of foam large enough to keep all my op-amps, MCUs, Series 4000, ADCs, DACs, 555 and 556s, etc. together so I can more easily find what I need when I need it.
Charles M. Lewis
Reviewed in the United States on July 11, 2024
I needed to safely store a bunch of ICs that had accumulated in verious places in my shop. I wanted to be able to cut the foam into sizes that would fit storage boxes I had on hand. This stuff cut easily, and was a good thickness for my chips.
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