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Hilitand BGA Reballing Stencils Template Accurate Positioning CPU Phone Tin Reballing Stencil for S9 Series

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$7.56

$ 3 .99 $3.99

In Stock
  • FAST TINNING SPEED: Our reballing stencil will not change under high temperature, and the tinning speed is fast, which can improve the efficiency of tinning.
  • SUITABLE : The CPU tin reballing stencil is suitable for S9 and S9+ series, for Qualcomm Snapdragon 845 and for Exynos 9810 CPU.
  • EASY TO USE: CPU tinning stencil is very portable, can be used as you , easy to use, is a good maintenance and DIY tools.
  • MULTIPLE IC RECESSES: Tin reballing stencil has multiple IC recesses on the main body of the stencil with half engraving process to effectively preventing small ICs from sticking to tin and protecting small ICs from breaking corners.
  • POSITIONING: The tin planting stencil can be precisely positioned and has a compact appearance for use in different applications.


Product Description

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BGA Reballing Stencils Template Accurate Positioning CPU Phone Tin Reballing Stencil for Samsung S9 Series

YT

FAST TINNING SPEED: Our reballing stencil will not change under high temperature, and the tinning speed is fast, which can improve the efficiency of tinning.

SUITABLE MODELS: The CPU tin reballing stencil is suitable for Samsung S9 and S9+ series, for Qualcomm Snapdragon 845 and for Exynos 9810 CPU.

MULTIPLE IC RECESSES: Tin reballing stencil has multiple IC recesses on the main body of the stencil with half engraving process to effectively preventing small ICs from sticking to tin and protecting small ICs from breaking corners.

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Specification:

Item Type: Phone Tin Reballing Stencil

Material: Stainless steel

Pitch: Approx. 0.12mm /0.005in

Applicable CPU: For Qualcomm Snapdragon 845 and for Exynos 9810 CPU

Applicable Model: For Samsung S9 and for S9+ series

How to Use:

Directtouse.

Package List:

1 x Phone Tin Reballing Stencil